ATTRIBUTES
STANDARD
ADVANCED
EMERGING
Line / Space
.005 /.005
.003 / .003
.002 /.002
Copper Foil Oz., min / max
½ / 1
½ / 3
¼ / 4
Pad Size, int. (dia over drill)
.014
.008
.006
Pad Size, ext. (dia over drill)
.012
.008
.006
Drill-To-Metal (relief dia over drill)
.020
.016
.008
Drill Size, min (thru & buried)
.012
.008
.006
Drill Size, min (blind via)
.010
.006
.004
Slot Size, min
.060
.030
.020
Aspec Ratio thk/drl (thru & buried)
7:1
10:1
14:1
Aspec Ratio thk/drl (blind)
1/3:1
1/2:1
1:1
Hole Location Tolerance (TP)
+/-.008
+/-.007
+/-.0055
Hole-To-Image Tolerance
+/-.006
+/-.004
+/-.003
Hole Plated Size Tolerance
+/-.003
+/-.002
+.001/-.002
Hole unPlated Size Tolerance
+/-.002
+/-.001
+/-.0005
Panel, max
18 x 24
21 x 24
24 x 36
Board Size, max
16.5 x 22.5
19.0 x 22.0
22.0 x 34.0
Thickness, finished max
.125
.250
.275
Thickness, finished min
.012
.008
.006
Thickness, finished tolerance
+/-10% or +/-.007
+/-8% or +/-.005
+/-5% or +/-.002
Layers, number max
24
30
44
Dielectric, min
.004
.002
.0015
Warpage, per inch
. .(dependent on stack symmetry)
.010
.005
.003
SMT Center-to center, min
.020
.008
.004
SolderMask Dam, min
.006
.004
.003
SolderMask Clearance, min
.004
.003
.002
Legend Line, min
.007
.005
.0035
Finishes:
Solder Hal, Entek, Gold hard/soft/imer
Carbon, Silver, Tin
= = = =
Rout Dimension Tolerance
+/-.010
+/-.007
+/-.005
Internal Radius, min
.030
.015
.010
Vscore Depth Tolerance
+/-.005
+/-.004
+/-.003
Electrical Test: pitch/feature, min
.010 / .005
.005 / .002
.003 / .0015
Impedance Tolerance
+/-10% or 5 ohm
+/-8% or 3 ohm
+/-5% or 2 ohm
Fill Hole: Surface Planarity
. . . . . . . Aspect Ratio thk/drl
+.001/-.003
2:1
+.0005/-.002
5:l
+.000/-001
10:1
HDI: Construction
1+1
2+2
3+3

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